TSMC crossover 3D DRAM is no show! Changxin production expansion is the real threat

In response to market rumors on November 11, TSMC evaluated its march into 3D DRAM at the request of Nvidia. Gao Qiquan, chairman of Zhaojie Technology and former executive chairman of Yangtze River Storage, who is known as the godfather of DRAM, gave a direct judgment at the media exchange on November 10: "TSMC cannot do 3D DRAM."

The core argument of Gao Qiquan lies in the essential differences in technical barriers. He pointed out that logic chips and DRAM are completely different technical fields, and even if TSMC has the world's most advanced wafer manufacturing capabilities, it does not mean that it has the mass production competitiveness of DRAM.

He recalled that in the early years, the world advanced had tried to enter the field of memory, and eventually failed and turned to foundry. He believed that TSMC could not go back this way.

Compared with the cross-border rumors of TSMC, Gao Qiquan believes that the real industry impact comes from the crazy expansion of Changxin Storage in the mainland. He warned that Changxin Storage is building fabs in Beijing, Shanghai and other places, and a large number of new capacity is expected to be opened within two years.

Gao Qiquan stressed that even if Changxin is still limited to EUV regulation and stays in the mature process, the huge capacity scale will be enough to cause oversupply in the global memory market and put great pressure on the global storage giant to survive.

Gao Qiquan also has reservations about the hotly discussed 3D DRAM technology route, and believes that it cannot be easily realized at this stage. TSMC's response to the rumors has been consistent: it does not comment on market speculation.

This debate around 3D DRAM is essentially a stress test of the boundaries between foundry and memory manufacturing in the face of bursting AI storage demand and geopolitical controls.

Source: MyDrivers (Fast Technology). Content is presented with source attribution. Read the original report.